Course Outline

• SAFETY & PRECAUTION IN MOBILE PHONE WORKSHOP.
• HEAT CONTROL (USING SOLDERING STATION)
• HEAT CONTROL (USING REWORK STATION)
• MAKING MICRO JUMPER& PCB LINE SCRATCHING.
• RECONSTRUCTION OF MISSING PADS.
•  BGA IC REBAILLING.
• REMOVAL AND INSTALLATION OF BGA IC.
• REMOVAL AND INSTALLATION OF FPC.
• HOW TO USE ZXW & JCID TO TROUBLESHOOT.
• IDENTIFICATION AND FUNCTIONS OF ALL IC.
• REMOVING AND INSTALLING OF EMI SHIELD USING DIFFERENT METHOD.
• REMOVAL AND CLEANING OF EPOXY GLUE BGA IC.
• BOOT SEQUENCE [DETECT FAULT VIA CURRENT].
• HOW TO USE MULTIMETER
• HOW TO USE SHORT KILLER EFFECTIVELY
• HOW TO USE THERMAL CAMERA EFFECTIVELY.
• REMOVING OF INTERPOSER IPHONE BOARDS 
• INSTALLATION OF INTERPOSER IPHONE BOARDS
• RECONSTRUCTION OF MISSING PADS ON INTERPOSER BOARDS.
• DATA RECOVERY.
• DISPLAY CIRCUIT.
• BACKLIGHT CIRCUIT.
• TOUCH CIRCUIT.
• AUDIO CIRCUIT.
• WIFI CIRCUIT.
• CHARGING CIRCUIT.
• HOW TO CLEAN OXIDE PAD.
• REMOVAL AND INSTALLATION OF STRAIGHT BOARDS NAND.
• HOW TO SAFELY REMOVE DOUBLE BOARD NAND.
• PROGRAMMING OF NAND IC USING JC REPAIR.
• HOW TO UPGRADE IPHONE MEMORY
• ITUNES ERROR.
• PANIC ERROR.